ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,591, issued on Aug. 11, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.). "Side mounted cable cartridge" was invented by W... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,592, issued on Aug. 11, was assigned to Keo Civil LLC (Cody, Wyo.). "Casualty-resistant enclosure for a micro data center" was invented by ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,593, issued on Aug. 11, was assigned to NIDEC Corp. (Kyoto, Japan). "Cooling unit with inclined radiator and air blower with suction port o... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,594, issued on Aug. 11, was assigned to Cooler Master Co. Ltd. (Taipei City, Taiwan). "Liquid cooling heat exchange casing" was invented by... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,595, issued on Aug. 11, was assigned to NVIDIA Corp. (Santa Clara, Calif.). "Cold plate with folded heat dissipation features for datacente... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,596, issued on Aug. 11, was assigned to APALTEK Co. LTD. (Shenzhen, China). "Integrated preheated pump-driven two-phase flow system" was in... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,597, issued on Aug. 11, was assigned to Siemens AG (Munich). "Cooling device for cooling a semiconductor module and converter with the cool... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,598, issued on Aug. 11, was assigned to KMW Inc. (Hwaseong-si, South Korea). "Wireless communication apparatus" was invented by Duk Yong Ki... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,599, issued on Aug. 11, was assigned to NXP B.V. (Eindhoven, Netherlands). "Heatsink device" was invented by Yothin Komchuad (Klongluang, T... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,600, issued on Aug. 11, was assigned to Mitsubishi Electric Corp. (Tokyo). "Electric component module" was invented by Ryosuke Kado (Tokyo)... Read More